Vertical Diffusion Furnace

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It is mainly used in the production and manufacturing of semiconductor devices such asintegrated circuits, power devices, MEMS, and VCSEL. lts main functions include performing processes such as diffusion, oxidation, and annealing on wafers to achieve precise doping otimpurities and construct components such as transistors, resistors, and capacitors. For example, it is used in the manufacturing of integrated circuits with 28nm and above nodes.

Main Parameters

● Process size: Suitable for 8-inch wafers

● Operating temperature: Usually between 200℃ and 1300℃

● Length of the constant temperature zone: Generally, there are various specifications such as 450mm, 600mm, 800mm,and 1100mm

● Accuracy of the constant temperature zone: Higher than ±0.5℃

● Single-point temperature stability: Within the range of 600°C to 1300℃, it can reach ±0.5°C/24h.

Main Features

● High degree of automation: It is easier to achieve automated operation compared to horizontal diffusion furnaces. It can cooperate with the Overhead Hoist Transport (OHT) automation system and realize the automatic loading and unloading and transportation of wafers through devices such as manipulators. This improves production efficiency and reduces errors and contamination caused by manual operation.

● Good particle control: The quartz boat is perpendicular to the horizontal plane, which can reduce particle contamination. Compared with horizontal diffusion furnaces, during the process, it is more conducive to maintaining the cleanliness of the furnace environment, reducing the contamination of particles on the wafers, and improving the product yield.

● Precise temperature control: It has high-precision temperature field control technology, which can better control the temperature uniformity, ensure the consistency of process parameters at each point on the wafer, and is beneficial to improving the repeatability of the process and product quality.

● High operation safety: The structural design makes the risk of operators coming into contact with high-temperature components and hazardous gases relatively low during the loading and unloading and maintenance processes, improving the safety of operation.