Soft-landing Diffusion System
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  • Soft-landing Diffusion System

Soft-landing Diffusion System

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It is used in processes such as doping (e.g., boron and phosphorus diffusion), oxidation, and annealing. By adopting advanced control algorithms and precise hardware equipment, it can achieve high-precision control of the impurity diffusion depth and concentration distribution. Compared with traditional difusion methods, it offers higher diffusion accuracy and better repeatability, thereby improving the product yield and performance consistency.
The soft-landing diffusion system utilizes end-deceleration control and high-precision positioning, which significantly reduces the risk of mechanical damage to wafers during high-temperature processes. it is darticularly suitable for the manutacturing scenarios of high-value wafers and brittle materials, capable of enhancing the overall production yield and reducing material losses.

Main Parameters

● Applicable Wafer Size: 4-8 inches (with compatibility design)

● Temperature Range: 600-1300℃ (maximum controllable temperature rise up to 1300℃)

● Temperature Control Accuracy: ±0.5℃

● Constant-temperature Zone Length: 300-1500mm

● MFC Gas Control Accuracy: ±0.5% F.S, and the gas path has a slow - start function

 

 

Core Technological Advantages

Full Automation Control

● SECS/GEM Integration: Equipped with a standard SECS/GEM communication interface, it can seamlessly connect to the factory automation svstem, enabling real- time monitoring of equipment status, remote parameter adjustment, and efficient exchange of production data, thus providing asolid foundation for inteligent manufacturing.

Anti-fragmentation Design

● It uses flexible deceleration and precise positioning technology. When the boat-pushing/pulling mechanism approaches the end of the process tube, it automatically decelerates to prevent thesilicon wafers from breaking due to sudden stops or colisions.

● The fragmentation rate can be reduced to less than 0.1% (the fragmentation rate of traditional hard-landing systems is usually more than 1%).

High-precision Control

● The speed range of the boat pushing/puling mechanism is 20-1000 mm/min, and the speed control accuracy reaches ±0.5 mm/min, which can meet the feeding rhythm requirements of diferent processes.

Compatibility and Stability

● It supports the compatible transfer of 4-8 inch silicon wafers and is adaptable to various types of boats(such as quartz boats and silicon carbide boats).

● It uses a servo motor + encoder feedback system, and the long-term running position repeatability accuracyis is ≤+0.5 mm.

Intelligent Linkage

● It is in real-time linkage with the furnace tube temperature and gas flow control systems to ensure the synchrony of the process.

● lt has a function of abnormal vibration monitoring, which can automatically trigger the shutdown protection.

High-Precision Temperature Control

● Temperature Control Accuracy: The temperature control accuracy reaches ±0.5°C, and the single-pointtemperature stabilityis ±0.5°C/24 hours.

● Control Modes: Supports cascade control and automatic adjustment of the constant-temperature zone.

● Thermocouple Technology: Employs S/R type thermocouples and cold-junction temperature compensation technology to reduce environmental interference.

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