Diffusion Furnace

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It is mainly applied to processes such as doping, oxidation, annealing, alloying and sintering in integrated circuits, discrete devices, and power electronic devices controlling the impurity distribution and electrical properties of semiconductor materials. Meanwhile, it supports the thermal diffusion and oxidation processes of optoelectronic devices, as well as microelectronic process experimental teaching in universities and research institutions, such as curriculum designs like thermal oxidation and thermal diffusion.

Main Parameters

● Applicable Wafer Size: 4-8inches (with compatibility design)

● Operating Temperature Range: 600-1300℃ (maximum controllable temperature rise up to 1300℃)

● Temperature Control Accuracy: ±0.5℃

● Constant-temperature Zone Length:300-1500mm

● MFC Gas Control Accuracy: +0.5% F.S, and the gas path has a slow - start function

● Boat Pushing/Pulling System: The speed range is 20- 1000mm/min, with an accuracy of + 1mm/min

Core Technological Advantages

Full Automation Control

● SECS/GEM Integration: Equipped with a standard SECS/GEM communication interface, it can seamlessly connect to the factory automation svstem, enabling real- time monitoring of equipment status, remote parameter adjustment, and efficient exchange of production data, thus providing asolid foundation for inteligent manufacturing.

● Integrated Control System: Utilizes an integrated control system combining an industrial computerand a PLC, achieving full-automatic control of temperature, gas flow, and boat pushing/puling. It supports the storage and retrieval of multiple process curves.

● Power-outage Memory Function: It has a power-outage memory function, allowing the process to resume after power restoration, minimizing losses caused by process interruptions.

High-Precision Temperature Control

● Temperature Control Accuracy: The temperature control accuracy reaches + 0.5℃, and the single-point temperature stability is +0.5℃/24 hours.

● Control Modes: Supports cascade control and automatic adjustment of the constant-temperature zone.

● Thermocouple Technology: Employs S/R type thermocouples and cold-junction temperature compensation technology to reduce environmental interference.

Safety and Reliability

● Multiple Safety Protection Mechanisms: Features multiple safety protection mechanisms,including over-temperature alarms, gas interlocks, thermocouple break alarms, and a slow-start function.

● High-Quality Componey components (such as MFC gas flow meters and siliconnts: Ke carbideboat pushing/pulling devices) are made of imported or highly corrosion-resistant materials to ensure long-term stable operation.

Flexible Configuration

● Tube System Options: Supports 1-4 tube systems, with process tube diameters rangingfrom Ф 100 to 400mm to meet different production requirements.

● Wafer Loading Options: Offers a choice between manual and automatic wafer loading methods. The cleanliness of the clean bench can reach Class 100 (in a Class 10,000 factory environment).