Vertical Diffusion Furnace

It is mainly used in the production and manufacturing of semiconductor devices such asintegrated circuits, power devices, MEMS, and VCSEL. lts main functions include performing processes such as diffusion, oxidation, and annealing on wafers to achieve precise doping otimpurities and construct components such as transistors, resistors, and capacitors. For example, it is used in the manufacturing of integrated circuits with 28nm and above nodes.

Diffusion Furnace

It is mainly applied to processes such as doping, oxidation, annealing, alloying and sintering in integrated circuits, discrete devices, and power electronic devices controlling the impurity distribution and electrical properties of semiconductor materials. Meanwhile, it supports the thermal diffusion and oxidation processes of optoelectronic devices, as well as microelectronic process experimental teaching in universities and research institutions, such as curriculum designs like thermal oxidation and thermal diffusion.

Soft-landing Diffusion System

It is used in processes such as doping (e.g., boron and phosphorus diffusion), oxidation, and annealing. By adopting advanced control algorithms and precise hardware equipment, it can achieve high-precision control of the impurity diffusion depth and concentration distribution. Compared with traditional difusion methods, it offers higher diffusion accuracy and better repeatability, thereby improving the product yield and performance

LPCVD SYSTE

It is mainly used to deposit high-quality thin films on the wafer surface through chemical reactionsin a low-pressure environment, it can be used in processes such as depositina polvsilicon (Poly - Si) silicon nitride (Si3N4) thin films, silicon oxide (Si02) thin films, BPSG thin films, LTO thin films, HTo thinfilms,SlPOS thin films, BSG thin films, and PSG thin films.

LED Alloy Furnace

Cascade temperature control system, high precision in constant temperature zone; High anti-interference ability; Multiple processing pipeline available for flexibleconfiguration,Supporting SECS/GEM Communication.

Anneal Furnace

Automatic control operation for processing recipe, smart heating and cooling ramp control, storing multiple groups of PlD parameters, system malfunction detection alarm

Vacuum Alloy Furnace

Types: Single tube horizontal furnace. Feeding method: manual or automatic. Furnace body movement: automatic control (the furnace body has the function of automatically closing the door when moving the chamber).

Oxygen-free Oven

Oxygen-free ovens are used in processessuch as dust-free drying of semiconductors .During the operation of the equipment, the oxygen content in the chamber is set. The system automatically activates the supply of N2 according to the oxygen content in the chamber,controlling the oxygen content within the set range.This prevents the materials from being oxidized during the baking process.

Liquid Phase Epitaxial Furnace

LPE equipment (Liquid Phase Epitaxial) is a device for growing thin film crystals inliquid phase, mainly used for the liquid phase epitaxial growth of compound epitaxial films, the growth of YlG、RlG magneto-optical ferrite single crystal materials, etc. lt is a key process equipment in the development and production of optoelectronic devices.

Vertical Vacuum Sintering Furnace

lt is applied to the growth of optical crystals such as calcium fluoride, magnesium fluoride, lithiumniobate, lithium tantalate, and scintillation crystals such as sodium iodide, cesium iodide, bismuth germanate. lt can also be used to grow new crystal materials such as metal halide perovskites.