Semiconductor Processing Equipment
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It is mainly used in the production and manufacturing of semiconductor devices such asintegrated circuits, power devices, MEMS, and VCSEL. lts main functions include performing processes such as diffusion, oxidation, and annealing on wafers to achieve precise doping otimpurities and construct components such as transistors, resistors, and capacitors. For example, it is used in the manufacturing of integrated circuits with 28nm and above nodes.
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It is mainly applied to processes such as doping, oxidation, annealing, alloying and sintering in integrated circuits, discrete devices, and power electronic devices controlling the impurity distribution and electrical properties of semiconductor materials. Meanwhile, it supports the thermal diffusion and oxidation processes of optoelectronic devices, as well as microelectronic process experimental teaching in universities and research institutions, such as curriculum designs like thermal oxidation and thermal diffusion.
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It is used in processes such as doping (e.g., boron and phosphorus diffusion), oxidation, and annealing. By adopting advanced control algorithms and precise hardware equipment, it can achieve high-precision control of the impurity diffusion depth and concentration distribution. Compared with traditional difusion methods, it offers higher diffusion accuracy and better repeatability, thereby improving the product yield and performance
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It is mainly used to deposit high-quality thin films on the wafer surface through chemical reactionsin a low-pressure environment, it can be used in processes such as depositina polvsilicon (Poly - Si) silicon nitride (Si3N4) thin films, silicon oxide (Si02) thin films, BPSG thin films, LTO thin films, HTo thinfilms,SlPOS thin films, BSG thin films, and PSG thin films.
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